New chip packaging and 3D
- To: misc
- Subject: New chip packaging and 3D
- From: Wayne Morellini <waynemm@xxxxxxxxxxx>
- Date: Wed, 09 Jun 1999 13:30:36 EST
Quickly
Toshiba is using "Paper Thin Packaging" (PTP) where they can stack 8 memory
dies on top of each other. The package comes in continuos tape with chips
stuck on the package which has the leads on the surface. Maybe a good cheap
process to stick a F21 and Memory closely bonded to gether for access speed.
Secondly, Microsoft is supporting a micro handheld browser protocoal called
the Wireless application Protocol (WAP) running a reduced version of Windows
CE. A reduced target for new processors.
Thanks.
Been looking over SZ's Voxel stuff and I think that it's pretty good for the
Misc integer series (if we only had F32 and F64's) if you have enough memory
throughput and memory. I think it is a great oppertunity for Misc in Voxel
stuff.
Thanks SZ I got the attachments, will be spending some time during the
vacation on them.
Wayne.
Wayne.
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